产品型号：TIP800 Series
产品品牌：Thermazing
产品单价：0
供货数量：
最小订量：
TIP系列相变化导热界面材料 TIP Series Phase Change Thermal Interface Material
TIP系列材料是热量增强聚合物，其重点是相变性，在常温下TIP系列材料是固体并且便于处理，当达到器件工作温度也就是达到材料变化温度的时候就会迅速变软并呈融化状态， 这样就完整的填充了散热器件和电子组件之间的空间，从而达到高效的导热作用。
特性
独有的技术避免了初始加热周期过后的额外抽空
产品具有天然黏性，无需粘合剂涂层，贴合时也无需散热器预热
低压力下低热阻
供应形式为带加在衬垫的卷料，方便手工或自动化操作应用
应用
高频率微处理器
笔记本和桌上型计算机
计算机伺服务器
热学测试台
DC／DC 变换器
内存模块
高速缓存芯片
型号(Item) 颜色(Color) 厚度(mm) 热阻抗@50psi (℃-in2／W) 相变温度℃ 使用温度范围℃
TIP805A 灰(Ashy) 0.127 0.020 50～60 -45～125
TIP805P 粉红(Pink) 0.127 0.024 50～60 -45～125
TIP805Y 黄(Yellow) 0.127 0.024 50～60 -45～125
TIP805B 黑(Black) 0.127 0.022 50～60 -45～125
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TIP Series Phase Change Thermal Interface Material
TIP Series materials are polymers that reinforce heat a n d featured by phase transformation. In room temperature， TIP series materials are solid a n d easy to process. However， in operating temperature when the states of the component materials are about to change， TIP series materials quickly get softened a n d melted so as to completely fill the gaps between the heat dissipation elements a n d the electronic components with highly efficient heat conduction.
Features
-Proprietary technology prevents excessive pump-out after initial heat cycle
-With naturally tacky a n d requires no adhesive coating or heat sink preheat for attachment
-Low thermal resistance at low pressures
-It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated
Applications
-High frequency microprocessors
-Notebook a n d desktop PCs
-Computer servers
-Thermal test sta n ds
-DC／DC Converts
-Memory modules
-Cache chips
-IGBTs
Item Color Tickness(mm) Thermal Impedance @50ps (℃-in2／W)
Phase Change Softening Temperature (℃) Continuous Use Temp (℃)
TIP805A Ashy 0.127 0.020 50～60 -45～125
TIP805P Pink 0.127 0.024 50～60 -45～125
TIP805Y Yellow 0.127 0.024 50～60 -45～125
TIP805B Black 0.127 0.022 50～60 -45～125
